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CPGA Package

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CPGA Package Reference

CPGA - Ceramic Pin Grid Array

Ceramic Pin Grid Array package dimensions and specifications

PackagePin CountBody Size (mm)Pitch (mm)Pin Grid
CPGA-444417.8 × 17.82.54Perimeter
CPGA-646424.1 × 24.12.54Perimeter
CPGA-686824.1 × 24.12.54Perimeter
CPGA-848429.2 × 29.22.54Perimeter
CPGA-10010031.8 × 31.82.54Matrix
CPGA-12012034.5 × 34.52.54Matrix
CPGA-13213235.6 × 35.62.54Matrix
CPGA-14414438.1 × 38.12.54Matrix
CPGA-16816840.6 × 40.62.54Matrix
CPGA-17617642.5 × 42.52.54Matrix
CPGA-20820845.7 × 45.72.54Matrix
CPGA-22322347.0 × 47.02.54Matrix
CPGA-25625650.8 × 50.82.54Matrix
CPGA-32132155.9 × 55.92.54Matrix
CPGA-37037049.5 × 49.52.54Matrix (staggered)
CPGA-46246252.6 × 52.62.54Matrix
CPGA-47847835.0 × 35.01.27Matrix

About CPGA

Ceramic Pin Grid Array (CPGA) packages feature a ceramic substrate with pins arranged in a grid pattern on the bottom. They are commonly used for microprocessors and high-performance ICs. The ceramic body provides excellent thermal conductivity and is suitable for high-reliability applications. CPGA packages are inserted into ZIF (Zero Insertion Force) sockets.

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CPGA Package is a free online calculator tool. Use it to get instant, accurate results for your electronics calculations.