Flip chip (FCBGA, FCCSP, WLCSP) package reference
Flip chip technology connects the die face-down directly to the substrate using solder bumps, eliminating wire bonds. This provides shorter interconnects, better electrical performance, and higher I/O density. WLCSP (Wafer Level Chip Scale Package) is the smallest form — the package is the same size as the die. FCBGA adds a substrate for larger dies with more connections.
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