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Grid Array Package

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Grid Array Packages (BGA/PGA)

Grid Array Packages

BGA, PGA, and LGA grid array package reference

BGA (Ball Grid Array)

PackageBall CountBody Size (mm)Pitch (mm)Application
μBGA-48485.0 × 5.00.50Memory, small ICs
μBGA-64645.0 × 5.00.50Flash memory
BGA-96968.0 × 8.00.80MCU, connectivity
BGA-14414410.0 × 10.00.80FPGA, DSP
BGA-19619612.0 × 12.00.80Processors
BGA-25625614.0 × 14.00.80SoC, FPGA
BGA-32432415.0 × 15.00.80Application processors
BGA-40040021.0 × 21.01.00FPGA
BGA-48448423.0 × 23.01.00High-end FPGA
BGA-62562525.0 × 25.01.00GPU, processors
BGA-90090031.0 × 31.01.00Server processors
BGA-1156115635.0 × 35.01.00Desktop CPUs
BGA-1517151740.0 × 40.01.00Server CPUs

PGA (Pin Grid Array)

PackagePin CountBody Size (mm)Pitch (mm)Application
PGA-686824.1 × 24.12.54Legacy processors
PGA-13213235.6 × 35.62.54486 processors
PGA-16816840.6 × 40.62.54Pentium era
PGA-32132149.5 × 49.52.54Pentium Pro
PGA-37037049.5 × 49.52.54Socket 370
PGA-46246252.6 × 52.62.54Socket A
PGA-47847835.0 × 35.01.27Socket 478
PGA-75475440.0 × 40.01.27Socket 754
PGA-93993940.0 × 40.01.27Socket 939
PGA-94094040.0 × 40.01.27Socket 940
PGA-1207120742.5 × 42.51.10AMD AM4

BGA vs PGA vs LGA

BGA: Solder balls on package bottom, permanently soldered to PCB. Best for high-density mobile/embedded.
PGA: Pins on package, inserted into socket. User-replaceable (AMD desktop CPUs).
LGA: Flat pads on package, pins on socket. Used by Intel desktop CPUs. Higher pin density than PGA.

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Grid Array Package is a free online calculator tool. Use it to get instant, accurate results for your electronics calculations.