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IC Package

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IC Package Types Reference

IC Package Types

Common IC package types: DIP, SOIC, QFP, BGA and more

Through-Hole IC Packages

PackagePin CountBody Width (mm)Pitch (mm)Notes
DIP-886.35 (narrow)2.54Op-amps, timers
DIP-14146.35 (narrow)2.54Logic gates
DIP-16166.35 (narrow)2.54Logic, drivers
DIP-18187.622.54MCU, interface
DIP-20207.622.54MCU, ADC
DIP-242415.24 (wide)2.54Memory, MCU
DIP-282815.24 (wide)2.54MCU (ATmega328)
DIP-323215.24 (wide)2.54Memory
DIP-404015.24 (wide)2.54MCU (8051, Z80)
DIP-484815.24 (wide)2.54Large memory
DIP-646419.052.54Processors

SMD IC Packages

PackagePin CountBody Size (mm)Pitch (mm)Notes
SOIC-8 (SO-8)85.0 × 4.01.27Op-amps, EEPROM
SOIC-14148.7 × 4.01.27Logic gates
SOIC-161610.0 × 4.01.27Drivers, logic
SOIC-202012.8 × 7.51.27MCU, interface
SOIC-282817.9 × 7.51.27MCU, memory
SSOP-883.0 × 3.00.65Shrink SOP
SSOP-16165.3 × 3.90.65Logic, converters
SSOP-20206.5 × 3.90.65Interface ICs
SSOP-282810.2 × 5.30.65MCU, ADC
TSSOP-883.0 × 3.00.65Thin shrink SOP
TSSOP-14145.0 × 4.40.65Logic
TSSOP-16165.0 × 4.40.65Logic, drivers
TSSOP-20206.5 × 4.40.65MCU, interface
MSOP-883.0 × 3.00.65Mini SOP
MSOP-10103.0 × 3.00.50Analog ICs
QFP-444410.0 × 10.00.80MCU
QFP-646410.0 × 10.00.50MCU, FPGA
QFP-10010014.0 × 14.00.50MCU, DSP
QFP-14414420.0 × 20.00.50FPGA, SoC
QFP-20820828.0 × 28.00.50Large FPGA

Package Selection

DIP for prototyping and through-hole designs. SOIC/SSOP for standard SMD. TSSOP/MSOP for space-constrained designs. QFP for high pin-count ICs. BGA for highest density (see Grid Array page). Consider soldering capability: DIP and SOIC are hand-solderable; fine-pitch QFP and BGA require reflow.

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IC Package is a free online calculator tool. Use it to get instant, accurate results for your electronics calculations.