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Leadless Package

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Leadless Packages (QFN, DFN, LGA)

Leadless Packages

QFN, DFN, and LGA leadless package reference

QFN (Quad Flat No-Lead)

PackagePad CountBody Size (mm)Pitch (mm)Exposed Pad
QFN-882.0 × 2.00.50Yes
QFN-10102.0 × 2.00.40Yes
QFN-12123.0 × 3.00.50Yes
QFN-16163.0 × 3.00.50Yes
QFN-20204.0 × 4.00.50Yes
QFN-24244.0 × 4.00.50Yes
QFN-28285.0 × 5.00.50Yes
QFN-32325.0 × 5.00.50Yes
QFN-36366.0 × 6.00.50Yes
QFN-40406.0 × 6.00.50Yes
QFN-44447.0 × 7.00.50Yes
QFN-48487.0 × 7.00.50Yes
QFN-56568.0 × 8.00.50Yes
QFN-64649.0 × 9.00.50Yes
QFN-686810.0 × 10.00.50Yes

DFN (Dual Flat No-Lead)

PackagePad CountBody Size (mm)Pitch (mm)Height (mm)
DFN-441.0 × 1.00.500.40
DFN-661.6 × 1.60.500.55
DFN-882.0 × 2.00.500.75
DFN-883.0 × 2.00.650.75
DFN-10103.0 × 3.00.500.75
DFN-12123.0 × 3.00.450.75
DFN-14144.0 × 3.00.500.75
DFN-16165.0 × 3.00.500.75

LGA (Land Grid Array)

PackagePad CountBody Size (mm)Pitch (mm)Application
LGA-882.0 × 2.50.80Sensors, MEMS
LGA-12122.5 × 2.50.50IMU sensors
LGA-14143.0 × 2.50.50Sensors
LGA-16163.0 × 3.00.50Accelerometers
LGA-24244.0 × 4.00.50Combo sensors
LGA-77577537.5 × 37.51.27Intel Core 2
LGA-1150115037.5 × 37.51.00Intel Haswell
LGA-1151115137.5 × 37.51.00Intel 6-9th gen
LGA-1200120037.5 × 37.51.00Intel 10-11th gen
LGA-1700170045.0 × 37.51.00Intel 12-14th gen

Advantages of Leadless Packages

Leadless packages offer smaller footprint, lower profile, better thermal performance (exposed pad), and reduced lead inductance compared to leaded packages. QFN is the most popular for MCUs and RF ICs. The exposed pad on the bottom provides excellent ground/thermal connection. Requires reflow soldering — not suitable for hand soldering.

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About this tool

Leadless Package is a free online calculator tool. Use it to get instant, accurate results for your electronics calculations.